Specific Process Knowledge/Thin film deposition/Deposition of Copper: Difference between revisions
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== Deposition of Cu == | == Deposition of Cu == | ||
Copper can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition | Copper can be deposited by e-beam evaporation, sputtering or electroplating. In the chart below you can compare the different deposition equipments. | ||
==Deposition of Copper using sputter deposition technique== | ==Deposition of Copper using sputter deposition technique== | ||