Specific Process Knowledge/Etch/DRIE-Pegasus/nanobosch/nanobosch6: Difference between revisions
Appearance
| Line 1: | Line 1: | ||
<!-- Ok, jmli 20170627 --> | |||
== Test run using AZ resist 24/9-2012 == | == Test run using AZ resist 24/9-2012 == | ||
<!-- revised 1/6-2015 by jmli --> | <!-- revised 1/6-2015 by jmli --> | ||
Revision as of 10:40, 27 June 2017
Test run using AZ resist 24/9-2012
| Substrate information | Wafer | C01296.05 |
|---|---|---|
| Mask | Travka50 mask in a few microns of AZ resist | |
| Date | 24/9-2012 | |
| Tool | Pegasus | |
| Process | Recipe | nanobosch6 |
| Tool conditioning | 3 minute TDESC clean | |
| Process duration | 15 minutes | |
| Purpose | test | |
| Characterisation | SEM Zeiss |
- SEM images
-
-
-
Test run using AZ resist 24/9-2012
| Substrate information | Wafer | C01296.09 |
|---|---|---|
| Mask | Travka80 mask in a few microns of AZ resist | |
| Date | 24/9-2012 | |
| Tool | Pegasus | |
| Process | Recipe | nanobosch6 |
| Tool conditioning | 3 minute TDESC clean | |
| Process duration | 15 minutes | |
| Purpose | test | |
| Characterisation | SEM Zeiss |
- SEM images
-
-
-