Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
No edit summary |
|||
Line 1: | Line 1: | ||
==Etching of Titanium== | ==Etching of Titanium== | ||
[[Image:fumehoodetch-chrom.jpg|300x300px|thumb|Fume hood: positioned in cleanroom 2. <br />Wet Etch of Chromium can take place in a beaker in this fume hood]] | |||
Etching of Titanium is done wet at Danchip. We have two solutions for titanium etching: | Etching of Titanium is done wet at Danchip. We have two solutions for titanium etching: | ||
Revision as of 10:03, 5 March 2008
Etching of Titanium
Etching of Titanium is done wet at Danchip. We have two solutions for titanium etching:
- BHF
- Cold RCA1
Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.
Comparing the two solutions
BHF | Cold RCA1 | |
---|---|---|
General description |
Etch of titanium with or without photoresist mask. |
Etch of titanium (as stripper or with eagle resist). |
Chemical solution | HF:NHF | NHOH:HFailed to parse (SVG (MathML can be enabled via browser plugin): Invalid response ("Math extension cannot connect to Restbase.") from server "https://wikimedia.org/api/rest_v1/":): {\displaystyle _2} O:HO - 1:1:5 |
Process temperature | Room temperature | Room temperature |
Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
Eagle resist |
Etch rate |
Not known (it bubbles while etching) |
Not known |
Batch size |
1-5 4" in beaker 1-25 wafers at a time in PP-etch bath |
1-5 4" wafer at a time |
Etch bath | Beaker or PP-etch bath in the fume hood in cleanroom 2. | Beaker |
Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. Make a note on the beaker of which materials have been processed. |
No restrictions when used in beaker. Make a note on the beaker of which materials have been processed. |