Specific Process Knowledge/Etch/ICP Metal Etcher/Barc Etch: Difference between revisions
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Revision as of 13:12, 15 May 2017
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Barc Etch
Etching barc with a dedicated recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need. Here is an example of a barc etch I have started testing. I have also tried with and O2 descum process for comparison.
| Parameter | Barc etch with CF4 | Barc etch with O2 |
|---|---|---|
| Coil power | 800W | 120w |
| Platen power | 100W | 15W |
| Pressure | 3 mTorr | 5mTorr |
| Flow rate CF4 | 4 sccm | |
| Flow rate H2 | 20sccm | |
| Flow rate O2 | 10sccm | |
| T | 0 degrees | 0 degrees |
| Parameter | Results with 'Barc etch with CF' | Results with 'Barc etch with O2' |
|---|---|---|
| Etch rate in barc | 52 nm in 30s [bghe 20150519] | 62 nm in 50s [bghe 20150521] |
| Etch rate in KRF resist | 27 nm in 30s [bghe 20150519] | 73 nm in 50s [bghe 20150521] |
| Selectivity KRF:Barc | 1:2 | 1:0.8 |
| Etch 65nm barc | Use 40-45s | Use 55-60s |