Specific Process Knowledge/Wafer cleaning/RCA: Difference between revisions

Revision as of 10:03, 21 February 2008

The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet). It consist of two solutions: RCA1 and RCA2

The RCA1 contains H2O, NH4OH and H2O2 (5:1:1). It is used for removed of light organics, partiticles and metal.

The RCA2 cantains H20, HCl and H2O2 (5:1:1). It is used for removel of heavy metals, alkalis and metal hydroxides.

Revision as of 08:43, 21 February 2008 view source Louise (talk \| contribs) danchip 4 edits New page: The RCA clean is used for cleaning the wafers before taking them into the furnaces. It consist of two solutions: RCA1 and RCA2 The RCA1 contains H2O, NH4OH and H2O2 (5:1:1). It is used fo...		Revision as of 10:03, 21 February 2008 view source BGE (talk \| contribs) Bureaucrats, danchip, Administrators 2,908 edits No edit summary Newer edit →
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	The RCA clean is used for cleaning the wafers before taking them into the furnaces.		The RCA clean is used for cleaning the wafers before taking them into the furnaces and a few other equipments (check the cross contamination sheet).
	It consist of two solutions: RCA1 and RCA2		It consist of two solutions: RCA1 and RCA2