Specific Process Knowledge/Etch/ICP Metal Etcher/Barc Etch: Difference between revisions
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! Parameter | ! Parameter | ||
! Barc etch with CF4 | ! Barc etch with CF4 | ||
! Barc etch with O2 | |||
|- | |- | ||
|Coil power||800W | |Coil power||800W||150w | ||
|- | |- | ||
|Platen power||100W | |Platen power||100W||15W | ||
|- | |- | ||
|Pressure||3 mTorr | |Pressure||3 mTorr||5mTorr | ||
|- | |- | ||
|Flow rate CF4||4 sccm | |Flow rate CF4||4 sccm|| | ||
|- | |- | ||
|Flow rate H2||20sccm | |Flow rate H2||20sccm|| | ||
|- | |||
|Flow rate O2||||20sccm | |||
|- | |- | ||
|} | |} | ||
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{| border="1" cellspacing="1" cellpadding="2" align="left" | {| border="1" cellspacing="1" cellpadding="2" align="left" | ||
! Parameter | ! Parameter | ||
! Results | ! Results with 'Barc etch with CF' | ||
! Results with 'Barc etch with O2' | |||
|- | |- | ||
|Etch rate in barc||'''52 nm in 30s''' ''[bghe 20150519]'' | |Etch rate in barc||'''52 nm in 30s''' ''[bghe 20150519]''||'''62 nm in 50s''' ''[bghe 20150521]'' | ||
|- | |- | ||
|Etch rate in KRF resist||'''27 nm in 30s''' ''[bghe 20150519]'' | |Etch rate in KRF resist||'''27 nm in 30s''' ''[bghe 20150519]''||'''73 nm in 50s''' ''[bghe 20150521]'' | ||
|- | |- | ||
|Selectivity KRF:Barc||'''1:2''' | |Selectivity KRF:Barc||'''1:2''' ||'''1:0.8''' | ||
|- | |- | ||
|Etch 65nm barc||'''Use 40-45s''' | |Etch 65nm barc||'''Use 40-45s'''||'''Use 55-60s''' | ||
|- | |- | ||
|} | |} | ||
<br/> | <br/> |
Revision as of 12:11, 22 May 2015
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Barc Etch
Etching barc with a dedicated recipe for barc etching is a good idea if you are on the limit of having enough DUV resist mask to reach etch depth you need.Here is an example of a barc etch I have started testing.
Parameter | Barc etch with CF4 | Barc etch with O2 |
---|---|---|
Coil power | 800W | 150w |
Platen power | 100W | 15W |
Pressure | 3 mTorr | 5mTorr |
Flow rate CF4 | 4 sccm | |
Flow rate H2 | 20sccm | |
Flow rate O2 | 20sccm |
Parameter | Results with 'Barc etch with CF' | Results with 'Barc etch with O2' |
---|---|---|
Etch rate in barc | 52 nm in 30s [bghe 20150519] | 62 nm in 50s [bghe 20150521] |
Etch rate in KRF resist | 27 nm in 30s [bghe 20150519] | 73 nm in 50s [bghe 20150521] |
Selectivity KRF:Barc | 1:2 | 1:0.8 |
Etch 65nm barc | Use 40-45s | Use 55-60s |