Specific Process Knowledge/Characterization/Sample preparation: Difference between revisions
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Close up. Bird View. Dark area is Silicon. Bright area is Silicon Dioxide. Residues of the SiO2 etching are apperent on top of the SiO2, i.e. particles a few nanometers in diameter. Most probably it is sputtered and redopsited Silicon Dioxide, but not confirmed. Attempts to remove them in 7-Up or HCl failed. | Close up. Bird View. Dark area is Silicon. Bright area is Silicon Dioxide. Residues of the SiO2 etching are apperent on top of the SiO2, i.e. particles a few nanometers in diameter. Most probably it is sputtered and redopsited Silicon Dioxide, but not confirmed. Attempts to remove them in 7-Up or HCl failed. | ||
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![[image: | ![[image:WaferWithCast_2.jpg|300x300px|thumb|left| | ||
Tilt angle 20 degree. Close up. Bird View. Dark area is Silicon. Bright area is Silicon Dioxide. The Silicon Dioxide sidewall is corrugated. | Tilt angle 20 degree. Close up. Bird View. Dark area is Silicon. Bright area is Silicon Dioxide. The Silicon Dioxide sidewall is corrugated. | ||
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