Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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!style="background:silver; color:black;" align="left"|Purpose | !style="background:silver; color:black;" align="left"|Purpose | ||
|style="background:LightGrey; color:black"|Equipment for dicing out samples.||style="background:WhiteSmoke; color:black"| | |style="background:LightGrey; color:black"|Equipment for dicing out samples.||style="background:WhiteSmoke; color:black"| | ||
* | *Pure Silicon samples | ||
* | *Silicon bonded to Silicon | ||
* | *Silicon bonded to Pyrex/Borofloat | ||
* | *Pyrex/Borofloat | ||
|- | |- | ||
!style="background:silver; color:black" align="left"|Performance | !style="background:silver; color:black" align="left"|Performance | ||