Specific Process Knowledge/Back-end processing/Disco Saw: Difference between revisions
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The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range. | The dicer can handle up to 6” wafers and 160x160 mm square samples and has a 192 mm cutting range. | ||
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===A rough overview of the performance Disco DAD321 Dicer=== | |||
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!style="background:silver; color:black;" align="left"|Purpose | |||
|style="background:LightGrey; color:black"|Equipment for dicing out samples.||style="background:WhiteSmoke; color:black"| | |||
*Single point profiles | |||
*Wafer mapping | |||
*Stress measurements by measuring wafer bow | |||
*Surface roughness on a line scan | |||
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!style="background:silver; color:black" align="left"|Performance | |||
|style="background:LightGrey; color:black"|Scan range xy||style="background:WhiteSmoke; color:black"| | |||
Line scan x: 50 µm to 200 mm | |||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Scan range z | |||
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50 Å to 262 µm | |||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution xy | |||
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down to 0.067 µm | |||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Resolution z | |||
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1Å, 10Å or 20Å | |||
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|style="background:silver; color:black"|.||style="background:LightGrey; color:black"|Max. scan depth as a function of trench width W | |||
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1.2(W[µm]-5µm) | |||
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!style="background:silver; color:black" align="left"|Hardware settings | |||
|style="background:LightGrey; color:black"|Tip radius | |||
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*5 µm 45<sup>o</sup> cone | |||
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!style="background:silver; color:black" align="left"|Substrates | |||
|style="background:LightGrey; color:black"|Substrate size | |||
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*up to 8" | |||
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|style="background:silver; color:black"|.|| style="background:LightGrey; color:black"|Substrate material allowed | |||
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*In principle all materials | |||
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