Specific Process Knowledge/Wafer cleaning: Difference between revisions

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'''Feedback to this page''': '''[mailto:labadviser@danchip.dtu.dk?Subject=Feed%20back%20from%20page%20http://labadviser.danchip.dtu.dk/index.php/Specific_Process_Knowledge/Wafer_cleaning click here]'''
== Clean with: ==
== Clean with: ==


Revision as of 12:54, 11 October 2013

Feedback to this page: click here

Clean with:

  • RCA - Two step process to remove organics and metals
  • 7-up & Piranha - Removes organics and alkali ions
  • 5% HF - Removing native oxide
  • IMEC - Cleaning before fusion bonding
  • Soap Sonic - Cleaning of "dirty" wafers when entering the cleanroom
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Wafer_cleaning&oldid=11502"