Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions
No edit summary |
|||
Line 23: | Line 23: | ||
|'''Chemical solution''' | |'''Chemical solution''' | ||
|HF:NH<math>_4</math>F | |HF:NH<math>_4</math>F | ||
| | |NH<math>_3</math>OH:H<math>_2</math>O<math>2</math>:H<math>_2</math>O - 1:1:5 | ||
|- | |- | ||
|'''Process temperature''' | |'''Process temperature''' |
Revision as of 10:21, 11 February 2008
Etching of Titanium
Etching of Titanium is done wet at Danchip. We have two solutions for titanium etching:
- BHF
- Cold RCA1 (as stripper)
Do it by making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4. BHF etching can also take place in the PP-etch bath in the fume hood in cleanroom 2.
Comparing the two solutions
BHF | Cold RCA1 | |
---|---|---|
General description |
Etch of titanium with or without photoresist mask. |
Etch of titanium (as stripper) |
Chemical solution | HF:NHF | NHOH:HO:HO - 1:1:5 |
Process temperature | Room temperature | Room temperature |
Possible masking materials |
Photoresist (1.5 µm AZ5214E) |
None |
Etch rate |
Not known (it bubbles while etching) |
Not known |
Batch size |
1-5 4" in beaker 1-25 wafers at a time in PP-etch bath |
1-5 4" wafer at a time |
Etch bath | Beaker or PP-etch bath in the fume hood in cleanroom 2. | |
Allowed materials |
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2. |
No restrictions when used in beaker. |