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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Line 47: Line 47:
PEB: 60s @ 110°C
PEB: 60s @ 110°C


Development: SP 15-30s. For lift-off SP 60s (sidewall angle ~15°)
Development: SP 30s. For lift-off SP 60s (sidewall angle ~15°)
*'''AZ MiR 701'''
*'''AZ MiR 701'''
Exposure dose: ?
Exposure dose: ?
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