Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/SOI/SOI: Difference between revisions
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Revision as of 10:33, 27 June 2017
Date | Substrate Information | Process Information | SEM Images | ||||||
---|---|---|---|---|---|---|---|---|---|
Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
15/12-2014 | 4" Wafer with travka65 mask | AZ standard | Si / 65 % | Pegasus/jmli | 10 minute TDESC clean | danchip/jml/showerhead/SOI/SOI, 96 cyc or 8:00 mins | S004745 | New showerhead |