Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessD/PrD02: Difference between revisions
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| 4" Wafer with travka50 mask | | 4" Wafer with travka50 mask | ||
| AZ standard | | AZ standard | ||
| Si / 50 | | Si / 50 % | ||
| Pegasus/jmli | | Pegasus/jmli | ||
| 10 minute TDESC clean | | 10 minute TDESC clean | ||
Revision as of 15:23, 16 January 2015
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 2/12-2014 | 4" Wafer with travka50 mask | AZ standard | Si / 50 % | Pegasus/jmli | 10 minute TDESC clean | danchip/jml/showerhead/prD/PrD02, 110 cyc or 6:25 mins | S004693 | New showerhead | |