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Specific Process Knowledge/Lithography/CSAR: Difference between revisions

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=== SEM inspection ===
=== SEM inspection ===


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{| class = "collapsible collapsed"  width=100% style = "border-radius: 10px; -moz-border-radius: 10px; -webkit-border-radius: 10px; -khtml-border-radius: 10px; -icab-border-radius: 10px; -o-border-radius: 10px; border: 3px solid #000000;"
! width=15% |  
! width=15% |  
! colspan="7" width=85% | SEM inspection of wafer 6.13, 100 nm exposed pattern, shot pitch 7 nm
! colspan="7" width=85% | SEM inspection of wafer 6.13, 100 nm exposed pattern, shot pitch 7 nm
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|}


{| class="wikitable collapsible collapsed" style="border: 5px solid black;"  style="width: 90%;" align="center"
!colspan="8"|  SEM inspection of wafer 6.13, 100 nm exposed pattern, shot pitch 7 nm
|-
|-
! 300 [muC/cm2]
| [[File:6_13_100nm_300_shot14.png|200px]]
| [[File:6_13_100nm_300_shot14_Lines.png|200px]]
| [[File:6_13_100nm_300_shot14_Holes.png|200px]]
| [[File:6_13_100nm_300_shot14_Holes2.png|200px]]
| [[File:6_13_100nm_300_shot14_Pillars.png|200px]]
| [[File:6_13_100nm_300_shot14_Test.png|200px]]
! ACHK NOT READY
|-
|}


{| class="wikitable collapsible collapsed" style="border: 5px solid black;"  style="width: 90%;" align="center"  
{| class="wikitable collapsible collapsed" style="border: 5px solid black;"  style="width: 90%;" align="center"  
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