Specific Process Knowledge/Lithography/CSAR: Difference between revisions
| Line 815: | Line 815: | ||
|- | |- | ||
|- | |- | ||
! rowspan=" | ! rowspan="12" align="center"| Recipe | ||
| rowspan=" | | rowspan="4"| Deposition step | ||
|Time | |||
|2.5 s | |||
|- | |||
| Gasses | | Gasses | ||
|C<sub>4</sub>F<sub>8</sub> 50 sccm, SF<sub>6</sub> 0 sccm | |C<sub>4</sub>F<sub>8</sub> 50 sccm, SF<sub>6</sub> 0 sccm | ||
| Line 826: | Line 829: | ||
|500 W Coil | |500 W Coil | ||
|- | |- | ||
| rowspan=" | | rowspan="4"| Etch step (boost) | ||
|Time | |||
|1.5 s | |||
|- | |||
| Gasses | | Gasses | ||
|C<sub>4</sub>F<sub>8</sub> | |C<sub>4</sub>F<sub>8</sub> 0 sccm, SF<sub>6</sub> 60 sccm | ||
|- | |- | ||
| Pressure | | Pressure | ||
| | |5 mTorr | ||
|- | |- | ||
| Powers | | Powers | ||
| | |400 W Coil, 50 W Platen | ||
|- | |- | ||
| rowspan=" | | rowspan="4"| Etch step (main) | ||
|Time | |||
|3.5 s | |||
|- | |||
| Gasses | | Gasses | ||
|C<sub>4</sub>F<sub>8</sub> | |C<sub>4</sub>F<sub>8</sub> 40 sccm, SF<sub>6</sub> 60 sccm | ||
|- | |- | ||
| Pressure | | Pressure | ||
| | |15 mTorr | ||
|- | |- | ||
| Powers | | Powers | ||
| | |400 W Coil, 20 W Platen | ||
|- | |- | ||