Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions

Revision as of 13:27, 17 January 2017

**Process runs**
Date	Substrate Information				Process Information				SEM Images
Date	Wafer info	Mask	Material/ Exposed area	Tool / Operator	Conditioning	Recipe	Wafer ID	Comments	SEM Images
18/8-2014	4" Danchip QC Wafer	1.5 µm AZ resist, daq2 mask	Si / 10 %	Pegasus/jmli	10 minute TDESC clean, 10 minute PR strip post process	danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes	S004257	OLD showerhead
20/11-2014	4" Danchip QC Wafer	1.5 µm AZ resist, daq2 mask	Si / 10 %	Pegasus/jmli	10 minute TDESC clean, 10 minute PR strip post process	danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes	S004580	OLD showerhead
1/12-2014	4" Danchip QC Wafer	1.5 µm AZ resist, daq2 mask	Si / 10 %	Pegasus/jmli	10 minute TDESC clean, 10 minute PR strip post process	danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes	S004671	New showerhead
15/12-2014	4" Danchip QC Wafer	1.5 µm AZ resist, daq2 mask	Si / 10 %	Pegasus/jmli	10 minute TDESC clean, 10 minute PR strip post process	danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes	S004746	New showerhead

Revision as of 15:49, 17 December 2014 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary ← Older edit		Revision as of 13:27, 17 January 2017 view source Jmli (talk \| contribs) DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers 4,416 edits No edit summary Newer edit →
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