Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions
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! width="40" | Wafer ID | ! width="40" | Wafer ID | ||
! width="40" | Comments | ! width="40" | Comments | ||
|- | |||
| 18/8-2014 | |||
| 4" Danchip QC Wafer | |||
| 1.5 µm AZ resist, daq2 mask | |||
| Si / 10 % | |||
| Pegasus/jmli | |||
| 10 minute TDESC clean, 10 minute PR strip post process | |||
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | |||
| S004257 | |||
! OLD showerhead | |||
| | |||
[[file:S004257-08.jpg|150px|frameless ]] | |||
[[file:S004257-09.jpg|150px|frameless ]] | |||
[[file:S004257-10.jpg|150px|frameless ]] | |||
[[file:S004257-11.jpg|150px|frameless ]] | |||
[[file:S004257-12.jpg|150px|frameless ]] | |||
[[file:S004257-13.jpg|150px|frameless ]] | |||
[[file:S004257-14.jpg|150px|frameless ]] | |||
|- | |||
|} | |||
{| border="2" cellpadding="0" cellspacing="0" style="text-align:center;" | |||
|+ '''Process runs''' | |||
|- | |||
! rowspan="2" width="40"| Date | |||
! colspan="4" width="120"| Substrate Information | |||
! colspan="4" | Process Information | |||
! rowspan="2" width="500" |SEM Images | |||
|- | |||
! width="30" | Wafer info | |||
! width="40" | Mask | |||
! width="40" | Material/ Exposed area | |||
! width="40" | Tool / Operator | |||
! width="40" | Conditioning | |||
! width="40" | Recipe | |||
! width="40" | Wafer ID | |||
! width="40" | Comments | |||
|- | |||
| 18/8-2014 | |||
| 4" Danchip QC Wafer | |||
| 1.5 µm AZ resist, daq2 mask | |||
| Si / 10 % | |||
| Pegasus/jmli | |||
| 10 minute TDESC clean, 10 minute PR strip post process | |||
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | |||
| S004257 | |||
! OLD showerhead | |||
| | |||
[[file:S004257-08.jpg|150px|frameless ]] | |||
[[file:S004257-09.jpg|150px|frameless ]] | |||
[[file:S004257-10.jpg|150px|frameless ]] | |||
[[file:S004257-11.jpg|150px|frameless ]] | |||
[[file:S004257-12.jpg|150px|frameless ]] | |||
[[file:S004257-13.jpg|150px|frameless ]] | |||
[[file:S004257-14.jpg|150px|frameless ]] | |||
|- | |- | ||
| 1/12-2014 | | 1/12-2014 | ||
Revision as of 14:54, 16 December 2014
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 18/8-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004257 | OLD showerhead |
|
| Date | Substrate Information | Process Information | SEM Images | ||||||
|---|---|---|---|---|---|---|---|---|---|
| Wafer info | Mask | Material/ Exposed area | Tool / Operator | Conditioning | Recipe | Wafer ID | Comments | ||
| 18/8-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004257 | OLD showerhead |
|
| 1/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004671 | New showerhead |
No SEM images due to bad cleaving |
| 15/12-2014 | 4" Danchip QC Wafer | 1.5 µm AZ resist, daq2 mask | Si / 10 % | Pegasus/jmli | 10 minute TDESC clean, 10 minute PR strip post process | danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes | S004746 | New showerhead |
|
