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Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,569 edits
No edit summary
Line 17: Line 17:
! width="40" | Comments
! width="40" | Comments
|-
|-
| 18/8-2014
| 1/12-2014
| 4" Danchip QC Wafer  
| 4" Danchip QC Wafer  
| 1.5 µm AZ resist, daq2 mask
| 1.5 µm AZ resist, daq2 mask
Line 24: Line 24:
| 10 minute TDESC clean, 10 minute PR strip post process
| 10 minute TDESC clean, 10 minute PR strip post process
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes  
| danchip/QC/QCprocA, 55 cycles (11+44) or 10:05 minutes  
| S004257
| S004671
! OLD showerhead  
! New showerhead  
|  
|  
[[file:S004257-08.jpg|150px|frameless ]]
No SEM images due to bad cleaving
[[file:S004257-09.jpg|150px|frameless ]]
 
[[file:S004257-10.jpg|150px|frameless ]]
[[file:S004257-11.jpg|150px|frameless ]]
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[[file:S004257-13.jpg|150px|frameless ]]
[[file:S004257-14.jpg|150px|frameless ]]
|-
|-
|}
|}
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