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Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,579 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,579 edits
Line 79: Line 79:
! width="100" | Key words
! width="100" | Key words
|-
|-
! rowspan="7" | Process A    <!-- recipe name -->
! rowspan="4" | Process A    <!-- recipe name -->
! Step1 11 cyc <!-- step -->
! Step1 11 cyc <!-- step -->
| rowspan="2" |20      <!-- chiller temp -->
| rowspan="2" |20      <!-- chiller temp -->
Line 114: Line 114:
| 140(1.5s) 45      <!-- platen power -->
| 140(1.5s) 45      <!-- platen power -->
|-
|-
| Cpoly1      <!-- step -->
! rowspan="4" | Process A    <!-- recipe name -->
| 30       <!-- chiller temp -->
! Step1 11 cyc <!-- step -->
! 1.2       <!-- dep time -->
| rowspan="2" |20       <!-- chiller temp -->
| 10       <!-- dep pressure -->
! 4       <!-- dep time -->
| 50       <!-- C4F8 flow -->
| 25       <!-- dep pressure -->
| 200       <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 0    <!-- O2 flow -->
| 600       <!-- coil power -->
| 2000       <!-- coil power -->
| 5.0      <!-- etch time -->
| 7.0      <!-- etch time -->
| 10       <!-- etch pressure -->
| 25(1.5s) 90>>150       <!-- etch pressure -->
| 20       <!-- C4F8 flow -->
| 0       <!-- C4F8 flow -->
| 60       <!-- SF6 flow -->
| 350(1.5s) 550       <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 5      <!-- O2 flow -->
| 400       <!-- coil power -->
| 2800       <!-- coil power -->
| 40     <!-- platen power -->
| 120>>140(1.5s) 45     <!-- platen power -->
! New       <!-- Showerhead -->
! rowspan="2" | Old       <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cpoly1 | 1]]      <!-- link processes -->
| rowspan="2" |[[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/ProcessA | 1]]      <!-- link processes -->
| Very aggressive, unusable  <!-- keywords -->
| rowspan="2" |    <!-- keywords -->
|-
|-
| Cpoly2      <!-- step -->
! Step2 44 cyc <!-- step -->
| 30      <!-- chiller temp -->
! 4       <!-- dep time -->
! 1.4     <!-- dep time -->
| 25       <!-- dep pressure -->
| 10       <!-- dep pressure -->
| 200       <!-- C4F8 flow -->
| 50       <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 0    <!-- O2 flow -->
| 600       <!-- coil power -->
| 2000       <!-- coil power -->
| 5.0      <!-- etch time -->
| 7.0      <!-- etch time -->
| 10       <!-- etch pressure -->
| 25(1.5s) 150       <!-- etch pressure -->
| 20       <!-- C4F8 flow -->
| 0       <!-- C4F8 flow -->
| 60       <!-- SF6 flow -->
| 350(1.5s) 550       <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 5      <!-- O2 flow -->
| 400       <!-- coil power -->
| 2800       <!-- coil power -->
| 40      <!-- platen power -->
| 140(1.5s) 45     <!-- platen power -->
! New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cpoly2 | 1]]      <!-- link processes -->
|    <!-- keywords -->
|-
| Cpoly3      <!-- step -->
| 30      <!-- chiller temp -->
! 1.6      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5.0      <!-- etch time -->
| 10      <!-- etch pressure -->
| 20      <!-- C4F8 flow -->
| 60      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
| 40      <!-- platen power -->
! New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cpoly3 | 1]]      <!-- link processes -->
|    <!-- keywords -->
|-
| Cpoly4      <!-- step -->
| 30      <!-- chiller temp -->
! 1.8      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5.0      <!-- etch time -->
| 10      <!-- etch pressure -->
| 20      <!-- C4F8 flow -->
| 60      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
| 40      <!-- platen power -->
! New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cpoly4 | 1]]      <!-- link processes -->
|    <!-- keywords -->
|-
| Cpoly5      <!-- step -->
| 30      <!-- chiller temp -->
! 2.0      <!-- dep time -->
| 10      <!-- dep pressure -->
| 50      <!-- C4F8 flow -->
| 0      <!-- SF6 flow -->
| 0    <!-- O2 flow -->
| 600      <!-- coil power -->
| 5.0      <!-- etch time -->
| 10      <!-- etch pressure -->
| 20      <!-- C4F8 flow -->
| 60      <!-- SF6 flow -->
| 5      <!-- O2 flow -->
| 400      <!-- coil power -->
| 40     <!-- platen power -->
! New      <!-- Showerhead -->
| [[Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange/polySi/Cpoly5 | 1]]      <!-- link processes -->
|    <!-- keywords -->
|-
|-
|}
|}
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