Specific Process Knowledge/Etch/IBE⁄IBSD Ionfab 300/Crystal Settings: Difference between revisions
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Revision as of 11:50, 12 December 2014
Settings for Crystal thickness monitor 1 | |||||
Date | Tooling factor: TiO2 | Tooling factor: SiO2 | Tooling factor: Si | ||
---|---|---|---|---|---|
22-7-2014 | 1.573 (wafer center) | ||||
B | B1 | B2 | B3 | ||
C | C1 | C2 | C3 | ||
D | D1 | D2 | D3 |
Settings for Crystal thickness monitor 2 | |||||
Date | Tooling factor: TiO2 | Tooling factor: SiO2 | Tooling factor: Si | ||
---|---|---|---|---|---|
22-7-2014 | 1.573 (wafer center) | ||||
B | B1 | B2 | B3 | ||
C | C1 | C2 | C3 | ||
D | D1 | D2 | D3 |