Specific Process Knowledge/Etch: Difference between revisions
No edit summary |
|||
| Line 2: | Line 2: | ||
*[[/Etching of Aluminium|Aluminium]] | *[[/Etching of Aluminium|Aluminium]] | ||
*[[Etching of Chromium|Chromium]] | *[[/Etching of Chromium|Chromium]] | ||
*[[Etching of Titanium|Titanium]] | *[[/Etching of Titanium|Titanium]] | ||
*[[Etching of Gold|Gold]] | *[[/Etching of Gold|Gold]] | ||
*[[Etching of Platin|Platin]] | *[[/Etching of Platin|Platin]] | ||
*[[Etching of Polymer|Polymer]] | *[[/Etching of Polymer|Polymer]] | ||
*[[Etching of Silicon|Silicon]] | *[[/Etching of Silicon|Silicon]] | ||
*[[Etching of Silicon Nitride|Silicon Nitride]] | *[[/Etching of Silicon Nitride|Silicon Nitride]] | ||
*[[Etching of Silicon Oxide|Silicon Oxide]] | *[[/Etching of Silicon Oxide|Silicon Oxide]] | ||
*[[Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | *[[/Etching of Bulk Glass|Bulk Glass]] - ''Borofloat (pyrex) and fused silica (quartz)'' | ||
== Choose a dry etch equipment == | == Choose a dry etch equipment == | ||
Revision as of 12:02, 17 October 2007
Choose material to be etched
- Aluminium
- Chromium
- Titanium
- Gold
- Platin
- Polymer
- Silicon
- Silicon Nitride
- Silicon Oxide
- Bulk Glass - Borofloat (pyrex) and fused silica (quartz)
Choose a dry etch equipment
Choose a wet etch
- Wet Silicon Nitride Etch
- Wet Silicon Oxide Etch (BHF)
- KOH Etch - Anisotropic silicon etch
- Wet Polysilicon Etch - Isotropic silicon etch
- Wet Aluminium Etch