Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions

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| Wafer centre
| Wafer centre

Revision as of 14:41, 10 December 2014

Comparison of processes before and after the change of showerhead in December 2014
Process Before After
Name/Type Description Wafer ID Comment SEM images Wafer ID Comment SEM images
Continuous black silicon recipe on blank wafer 15 mins, -10 degrees, 32 mtorr, 60 sccm SF6, 55 sccm O2, 70 W platen S004592 Wafer centre S004679 Wafer centre
S004592 Wafer edge S004679 Wafer edge
Switched etch of 1.8 µm polysilicon on BOX patterned with DUV 50 cycles, 30 degrees, 2.3/5 secs, 10/10 mtorr, 0/60 sccm SF6, 0/5 sccm O2, 50/20 sccm C4F8, 600/400 W coil, 0/40 W platen S004593 6" wafer

S004679 Wafer centre
S004593 Wafer edge S004679 Wafer edge