Specific Process Knowledge/Etch/DRIE-Pegasus/showerheadchange: Difference between revisions
No edit summary |
No edit summary |
||
Line 31: | Line 31: | ||
| [[file:S004679 edge.jpg |250px|frameless ]] | | [[file:S004679 edge.jpg |250px|frameless ]] | ||
|- | |- | ||
! rowspan="2" width="100"| Switched polysilicon etch on DUV wafer, (D/E) indicate Dep and Etch | |||
| rowspan="2" width="100"| 50 cycles, 30 degrees, 2.3/5 secs, 10/10 mtorr, 0/60 sccm SF<sub>6</sub>, 0/5 sccm O<sub>2</sub>, 50/20 sccm C<sub>4</sub>F<sub>8</sub>, 600/400 W coil, 0/40 W platen | |||
! rowspan="2" | |||
| | |||
| S004592 | | S004592 | ||
| Wafer centre | | Wafer centre |