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Specific Process Knowledge/Direct Structure Definition: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
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Jehan (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891, Bureaucrats, danchip, Administrators
1,093 edits
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials
|UV Lithography
|Depending on tool used
|2-Photon Polymerization Lithography
|Silicon wafers, Cover slips
|Nano Imprint Lithography
|Nano Imprint Lithography
|Nickel, aluminium, steel, FDTS
|Nickel, aluminium, steel, FDTS
|Laser Micromachining Tool
|Almost any
|Dicing saw
|Silicon, glass, GaN, bonded wafers, LiNbO3
|-
|-


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