Specific Process Knowledge/Characterization/Stress measurement: Difference between revisions
No edit summary |
|||
| Line 3: | Line 3: | ||
The procedure is as follows: | The procedure is as follows: | ||
==When deposition on one side of the wafer== | ==When the deposition is on one side of the wafer== | ||
#Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | #Measure the wafer bow on one of the profilometers (Tencor or Dektak 8). Save the measurement. It is a good idea to measure across most of the wafer in two directions perpendicular to each other. | ||
#Deposite the thin film | #Deposite the thin film | ||