Specific Process Knowledge/Direct Structure Definition: Difference between revisions
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|Sample with resist.<br> A 3D CAD model file in GWL format. Included software can convert 3D model in STL (Standard Tessellation Language) format to GWL files. | |Sample with resist.<br> A 3D CAD model file in GWL format. Included software can convert 3D model in STL (Standard Tessellation Language) format to GWL files. | ||
|Sample with polymer.<br> A stamp with the wanted pattern, usually in Si or SiO\rm{_2} however other materials could also be used. | |Sample with polymer.<br> A stamp with the wanted pattern, usually in Si or SiO\rm{_2} however other materials could also be used. | ||
|A stamp/shim with the wanted pattern, usually in Ni | |A stamp/shim with the wanted pattern, usually in Ni or Al. | ||
|A 2D CAD model file in DXF or CONX format. [[Specific Process Knowledge/Lithography/UVLithography/Mask Design| Clewin5]] can convert GDS and CIF files to DXF format. | |A 2D CAD model file in DXF or CONX format. [[Specific Process Knowledge/Lithography/UVLithography/Mask Design| Clewin5]] can convert GDS and CIF files to DXF format. | ||
|Number of lines and pitch in each direction. Your wafer. | |Number of lines and pitch in each direction. Your wafer. | ||