Specific Process Knowledge/Lithography/EBeamLithography: Difference between revisions
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| [[File:Chip example.png|right|200px]] | | [[File:Chip example.png|right|200px]] | ||
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| Correct mark || Definition of length and width, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || P and Q | | Correct design of global (wafer) mark || Definition of length and width of global mark, use L = 500-1000 µm, W 3-5 µm || Text around mark not recommended || Global mark (P and Q) positions on wafer || Example of chip with 4 chip marks | ||
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