Specific Process Knowledge/Wafer cleaning/IMEC: Difference between revisions
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===IMEC process for cleaning of wafers | ===The IMEC process is used for cleaning of wafers prior to fusion bonding:=== | ||
This procedure is based on the IMEC cleaning process: ''M. Meuris et al. "The IMEC clean: A new concept for particle and metal removal on Si surfaces.", Solid state Technology, Vol. 38, Issue 7, pp 109-113, 1995.'' <br \> | |||
Has been slightly modified by Karen Birkelund. | Has been slightly modified by Karen Birkelund. | ||