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Specific Process Knowledge/Bonding: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
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Kabi (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
1,146 edits
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!Bonding temperature
!Bonding temperature
|Depending on the eutecticum 310°C to 400°C.  
|Depending on the eutecticum 310°C to 400°C.  
|Depending on defects 50°C to 400°C. For strong bonding strengths a subsequently anneal at 1000-1100°C is required.
|Depending on defects 50°C to 400°C.
|Depending on the voltage 300°C to 500°C Standard is 400°C.  
|Depending on the voltage 300°C to 500°C Standard is 400°C.  
|-
|-
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!Annealing temperature
!Annealing temperature
|No annealing  
|No annealing  
|1000°C in the bond furnace C3.  
|1000°C-1100°C in the anneal bond furnace C3.  
|No annealing
|No annealing
|-
|-
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