Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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!Equipment  
!Equipment  
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate:_90-110C|Hotplate: 90-110C]]
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Spin dryer 1]]
|<b>Spin dryer 1</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Spin dryer 2]]
|<b>Spin dryer 2</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Spin dryer 3]]
|<b>Spin dryer 3</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Spin dryer 4]]
|<b>Spin dryer 4</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Single Wafer Spin dryer 1]]
|<b>Single Wafer Spin dryer 1</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Single Wafer Spin dryer 2]]
|<b>Single Wafer Spin dryer 2</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Single Wafer Spin dryer 3]]
|<b>Single Wafer Spin dryer 3</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Critical point dryer]]
|<b>Critical point dryer</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|Ethanol fume dryer]]
|<b>Ethanol fume dryer</b>
|[[Specific_Process_Knowledge/#Wafer_and_sample_drying|N<sub>2</sub> guns]]
|<b>N<sub>2</sub> guns</b>
|-
|-



Revision as of 11:35, 14 November 2014

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Drying Comparison Table

Equipment Spin dryer 1 Spin dryer 2 Spin dryer 3 Spin dryer 4 Single Wafer Spin dryer 1 Single Wafer Spin dryer 2 Single Wafer Spin dryer 3 Critical point dryer Ethanol fume dryer N2 guns
Location
  • C-1
  • B-1
  • D-3
  • E-5
  • B-1
  • C-1
  • D-3
  • D-3
  • C-1
  • In fumehoods and at chemical benches
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
  • Drying
  • Drying
  • Drying
  • Drying sensitive samples. E.g. with cantilevers
  • Drying sensitive samples. E.g. with cantilevers
  • Drying all kind of samples.
Batch size
  • 1-25 100 mm wafers
*1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1-25 50 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • one 100 mm wafer
  • one 100 mm wafer
  • one 100 mm wafer
  • 1 to 5 wafers per run. Sizes: 2”, 4" or 6"
  • Pieces (up to 10x10mm)
  • 1-25 50 mm wafers
  • 1-25 100 mm wafers
  • Pieces if a suitable carrier is available
  • One sample at a time
Allowed materials
  • No restrictions
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions
  • No restrictions
  • No restrictions
  • No restrictions
  • Si,SiO2, Si3N4
  • Quartz and Pyrex
  • InAlP, GaAs
  • SU8
  • No restriction except for polymers
  • No restriction


Choose a drying equipment