Specific Process Knowledge/Wafer and sample drying: Difference between revisions
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{| border="2" cellspacing="0" cellpadding="2" | {| border="2" cellspacing="0" cellpadding="2" | ||
|-style="background:lightgray; color:black" | |||
| | !Equipment | ||
![[Specific_Process_Knowledge/Lithography/Baking#Hotplate:_90-110C|Hotplate: 90-110C]] | |||
|<b>Spin dryer 1</b> | |||
|<b>Spin dryer 2</b> | |||
|<b>Spin dryer 3</b> | |||
|<b>Spin dryer 4</b> | |||
|<b>Single Wafer Spin dryer 1</b> | |||
|<b>Single Wafer Spin dryer 2</b> | |||
|<b>Single Wafer Spin dryer 3</b> | |||
|<b>Critical point dryer</b> | |||
|<b>Ethanol fume dryer</b> | |||
|<b>N<sub>2</sub> guns</b> | |||
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|style="background:WhiteSmoke; color:black"| | |-style="background:WhiteSmoke; color:black" | ||
!Location | |||
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*C-1 | *C-1 | ||
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*B-1 | *B-1 | ||
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*D-3 | *D-3 | ||
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*E-5 | *E-5 | ||
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*B-1 | *B-1 | ||
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*C-1 | *C-1 | ||
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*D-3 | *D-3 | ||
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*D-3 | *D-3 | ||
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*C-1 | *C-1 | ||
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*In fumehoods and at chemical benches | *In fumehoods and at chemical benches | ||
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|-style="background:lightgray; color:black" | |||
!Purpose | |||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
*Rinsing + drying | *Rinsing + drying | ||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
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*Drying | *Drying | ||
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*Drying sensitive samples. E.g. with cantilevers | *Drying sensitive samples. E.g. with cantilevers | ||
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*Drying sensitive samples. E.g. with cantilevers | *Drying sensitive samples. E.g. with cantilevers | ||
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*Drying all kind of samples. | *Drying all kind of samples. | ||
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|-style="background:WhiteSmoke; color:black" | |||
!Batch size | |||
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*1-25 100 mm wafers | *1-25 100 mm wafers | ||
| | |*1-25 100 mm wafers | ||
*1-25 100 mm wafers | | | ||
*1-25 100 mm wafers | *1-25 100 mm wafers | ||
*1-25 150 mm wafers | *1-25 150 mm wafers | ||
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*1-25 50 mm wafers | *1-25 50 mm wafers | ||
*1-25 100 mm wafers | *1-25 100 mm wafers | ||
*1-25 150 mm wafers | *1-25 150 mm wafers | ||
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*one 100 mm wafer | *one 100 mm wafer | ||
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*one 100 mm wafer | *one 100 mm wafer | ||
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*one 100 mm wafer | *one 100 mm wafer | ||
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*1 to 5 wafers per run. Sizes: 2”, 4" or 6" | *1 to 5 wafers per run. Sizes: 2”, 4" or 6" | ||
* Pieces (up to 10x10mm) | * Pieces (up to 10x10mm) | ||
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*1-25 50 mm wafers | *1-25 50 mm wafers | ||
*1-25 100 mm wafers | *1-25 100 mm wafers | ||
*Pieces if a suitable carrier is available | *Pieces if a suitable carrier is available | ||
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*One sample at a time | *One sample at a time | ||
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|-style="background:lightgray; color:black" | |||
!Allowed materials | |||
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*No restrictions | *No restrictions | ||
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*Only for RCA cleaned wafers | *Only for RCA cleaned wafers | ||
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*No restrictions | *No restrictions | ||
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*No restrictions | *No restrictions | ||
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*No restrictions | *No restrictions | ||
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*No restrictions | *No restrictions | ||
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*No restrictions | *No restrictions | ||
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*Si,SiO2, Si3N4 | *Si,SiO2, Si3N4 | ||
*Quartz and Pyrex | *Quartz and Pyrex | ||
*InAlP, GaAs | *InAlP, GaAs | ||
*SU8 | *SU8 | ||
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*No restriction except for polymers | *No restriction except for polymers | ||
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*No restriction | *No restriction | ||
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Revision as of 11:30, 14 November 2014
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Drying Comparison Table
| Equipment | Hotplate: 90-110C | Spin dryer 1 | Spin dryer 2 | Spin dryer 3 | Spin dryer 4 | Single Wafer Spin dryer 1 | Single Wafer Spin dryer 2 | Single Wafer Spin dryer 3 | Critical point dryer | Ethanol fume dryer | N2 guns |
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| Purpose |
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| Batch size |
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*1-25 100 mm wafers |
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| Allowed materials |
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