Specific Process Knowledge/Lithography/Baking: Difference between revisions
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This section is under construction [[Image:section under construction.jpg|70px]] | This section is under construction [[Image:section under construction.jpg|70px]] | ||
Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist. | Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist on the associated spin coater. | ||
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