Specific Process Knowledge/Lithography/Baking: Difference between revisions
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==Oven: 120C - 250C== | ==Oven: 120C - 250C== | ||
[[Image:Oven120C-250C in C-1.jpg|300x300px|thumb|Oven: 120C - 250C is Situated in C-1]] | [[Image:Oven120C-250C in C-1.jpg|300x300px|thumb|Oven: 120C - 250C is Situated in C-1]] | ||
Variable temperature convection oven mostly used for baking of wafers as a hard baking step after development of photoresist. The set-point can be varied, but should always be returned to 120°C after use. | Variable temperature convection oven mostly used for baking of wafers as a hard baking step after development of photoresist. | ||
The set-point can be varied, but should always be returned to 120°C after use. | |||
'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 120C - 250C]''' | '''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=119 Oven: 120C - 250C]''' | ||