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Specific Process Knowledge/Lithography/Baking: Difference between revisions

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DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
Line 103: Line 103:
Film or pattern of all types except type IV
Film or pattern of all types except type IV
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All substrates
Respect the allowed materials on the associated spin coater
 
Film or pattern of all types
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Silicon, glass, and polymer substrates
Silicon, glass, and polymer substrates
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Pb, Te films
Pb, Te films
|Information is given at the individual hotplate
|III-V substrates
 
Respect the restrictions on the associated spin coater
|III-V substrates
|III-V substrates


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