Specific Process Knowledge/Lithography/Baking: Difference between revisions
| Line 114: | Line 114: | ||
!Restrictions | !Restrictions | ||
| | | | ||
|III-V, copper, steel substrates | |III-V, copper, steel substrates | ||
Pb, Te films | |||
|Information is given at the individual hotplate | |Information is given at the individual hotplate | ||
|III-V substrates | |III-V substrates | ||
Pb, Te films | |||
|III-V, copper, steel substrates | |III-V, copper, steel substrates | ||
|Resist is not allowed | |Resist is not allowed | ||