Specific Process Knowledge/Lithography/Baking: Difference between revisions
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= Hotplates = | = Hotplates = | ||
==Hotplate: 90-110C== | ==Hotplate: 90-110C== | ||
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'''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)]''' | '''The user manual, and contact information can be found in LabManager: [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=122 Hotplate 1 (SU8)] [http://labmanager.danchip.dtu.dk/function.php?module=Machine&view=view&mach=124 Hotplate 2 (SU8)]''' | ||
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==Fumehood hotplate== | |||
[[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]] | |||
Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist. | |||
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