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= Hotplates =
= Hotplates =


==90 C 4" hotplate==   
==Fumehood hotplate==   
[[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]]
[[Image:Hotplates.jpg|300x300px|thumb|Right: Hotplate 90 °C situated in C-1]]
This hotplate is mostly used for baking of single wafers at 90 °C as a soft baking step after a spin coating of photoresist.
Variable temperature hotplate mostly used for baking of single wafers as a soft baking step after a spin coating of photoresist.
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==110 C 4" hotplate==
[[Image:Hotplates.jpg|300x300px|thumb|Left: Hotplate 110 °C situated in C-1]]
The 110 °C hotplate is used for 2 different things; hard bake of resist, and image reversal baking between two exposures. It is recommended to hard bake for 2 min. For image reversal it is recommended to bake at least 100 sec., some bake for 120 sec.
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