Specific Process Knowledge/Etch/Etching of Titanium: Difference between revisions

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|General description
|'''General description'''
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Etch of titanium with or without photoresist mask.
Etch of titanium with or without photoresist mask.
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Etch of
Etch of
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|Chemical solution
|'''Chemical solution'''
|HF:NH<math>_4</math>F   
|HF:NH<math>_4</math>F   
|.  
|.  
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|Process temperature
|'''Process temperature'''
|Room temperature
|Room temperature


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|Possible masking materials:
|'''Possible masking materials'''
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Photoresist (1.5 µm AZ5214E)
Photoresist (1.5 µm AZ5214E)
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.
.
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|Etch rate
|'''Etch rate'''
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?
?
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?
?
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|Batch size
|'''Batch size'''
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1-25 wafers at a time
1-25 wafers at a time
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1-25 wafer at a time
1-25 wafer at a time
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|Size of substrate
|'''Size of substrate'''
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4" wafers
4" wafers
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4" wafers
4" wafers
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|Allowed materials
|'''Allowed materials'''
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No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  
No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.  

Revision as of 12:58, 31 January 2008

Etching of Titanium

Etching of Titanium is done wet at Danchip making your own set up in a beaker in a fume hood - preferably in cleanroom 2 or 4 or in the PP-etch bath in the fume hood in cleanroom 2. We have ?:

  1. BHF


Comparing the two solutions

BHF
General description

Etch of titanium with or without photoresist mask.

Etch of

Chemical solution HF:NHF .
Process temperature Room temperature
Possible masking materials

Photoresist (1.5 µm AZ5214E)

.

Etch rate

?

?

Batch size

1-25 wafers at a time

1-25 wafer at a time

Size of substrate

4" wafers

4" wafers

Allowed materials

No restrictions when used in beaker or PP-etch bath in the fume hood in cleanroom 2.

  • Aluminium
  • Silicon
  • Silicon Oxide
  • Silicon Nitride
  • Silicon Oxynitride
  • Photoresist
  • E-beam resist