Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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{| border="2" cellspacing="0" cellpadding="2"  
{| border="2" cellspacing="0" cellpadding="2"  


!colspan="2" border="none" style="background:silver; color:black;" align="center"|Equipment  
!colspan="1" border="none" style="background:silver; color:black;" align="center"|Equipment  
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 1</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 1</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 2</b>
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|-
|-
!style="background:silver; color:black;" align="center" width="60"|Location
!style="background:silver; color:black;" align="center" width="60"|Location
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*C-1
*C-1
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|-
|-
!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
|style="background:LightGrey; color:black"|
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*Drying
*Drying
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*Drying all kind of samples.
*Drying all kind of samples.
|-
|-
!style="background:silver; color:black" align="center" valign="center" rowspan="3"|Substrates
!style="background:silver; color:black;" align="center" width="60"|Batch size
|style="background:LightGrey; color:black"|Batch size
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*1-25 100 mm wafers
*1-25 100 mm wafers
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*One sample at a time
*One sample at a time
|-
|-
| style="background:LightGrey; color:black"|Allowed materials
!style="background:silver; color:black;" align="center" width="60"|Allowed materials
|style="background:WhiteSmoke; color:black"|
|style="background:WhiteSmoke; color:black"|
*No restrictions
*No restrictions

Revision as of 10:38, 14 November 2014

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Drying Comparison Table

Equipment Spin dryer 1 Spin dryer 2 Spin dryer 3 Spin dryer 4 Critical point dryer Ethanol fume dryer N2 guns
Location
  • C-1
  • B-1
  • D-3
  • E-5
  • D-3
  • C-1
  • In fumehoods and at chemical benches
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
  • Drying sensitive samples. E.g. with cantilevers
  • Drying sensitive samples. E.g. with cantilevers
  • Drying all kind of samples.
Batch size
  • 1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • ? 50 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1 to 5 wafers per run. Sizes: 2”, 4" or 6"
  • Pieces (up to 10x10mm)
  • 1-25 50 mm wafers
  • 1-25 100 mm wafers
  • Pieces if a suitable carrier is available
  • One sample at a time
Allowed materials
  • No restrictions
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions
  • Si,SiO2, Si3N4
  • Quartz and Pyrex
  • InAlP, GaAs
  • SU8
  • No restriction except for polymers
  • No restriction


Choose a drying equipment

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