Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
|style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
|style="background:WhiteSmoke; color:black"|<b>Critical point dryer</b>
|style="background:WhiteSmoke; color:black"|<b>Critical point dryer</b>
|style="background:WhiteSmoke; color:black"|<b>Ethanol Fume dryer</b>
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!style="background:silver; color:black;" align="center" width="60"|Location
!style="background:silver; color:black;" align="center" width="60"|Location
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|style="background:WhiteSmoke; color:black"|
*D-3
*D-3
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*C-1
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!style="background:silver; color:black;" align="center" width="60"|Purpose  
!style="background:silver; color:black;" align="center" width="60"|Purpose  
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*Drying
*Drying
*Rinsing + drying
*Rinsing + drying
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*Drying sensitive samples. E.g. with cantilevers
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|style="background:WhiteSmoke; color:black"|
*Drying sensitive samples. E.g. with cantilevers
*Drying sensitive samples. E.g. with cantilevers
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*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
*1 to 5 wafers per run. Sizes: 2”, 4" or 6"
* Pieces (up to 10x10mm)
* Pieces (up to 10x10mm)
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*1-25 50 mm wafers
*1-25 100 mm wafers
*Pieces if a suitable carrier is available
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| style="background:LightGrey; color:black"|Allowed materials
| style="background:LightGrey; color:black"|Allowed materials
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*InAlP, GaAs
*InAlP, GaAs
*SU8
*SU8
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*No restriction except for polymers
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Revision as of 15:34, 31 October 2014

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Drying Comparison Table

Equipment Spin dryer 1 Spin dryer 2 Spin dryer 3 Spin dryer 4 Critical point dryer Ethanol Fume dryer
Location
  • C-1
  • B-1
  • D-3
  • E-5
  • D-3
  • C-1
Purpose
  • Drying
  • Drying
  • Drying
  • Drying
  • Rinsing + drying
  • Drying sensitive samples. E.g. with cantilevers
  • Drying sensitive samples. E.g. with cantilevers
Substrates Batch size
  • 1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • ? 50 mm wafers
  • 1-25 100 mm wafers
  • 1-25 150 mm wafers
  • 1 to 5 wafers per run. Sizes: 2”, 4" or 6"
  • Pieces (up to 10x10mm)
  • 1-25 50 mm wafers
  • 1-25 100 mm wafers
  • Pieces if a suitable carrier is available
Allowed materials
  • No restrictions
  • Only for RCA cleaned wafers
  • No restrictions
  • No restrictions
  • Si,SiO2, Si3N4
  • Quartz and Pyrex
  • InAlP, GaAs
  • SU8
  • No restriction except for polymers


Choose a drying equipment