Specific Process Knowledge/Wafer and sample drying: Difference between revisions

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 |style="background:WhiteSmoke; color:black"|<b>Spin dryer 4</b>
 |style="background:WhiteSmoke; color:black"|<b>Critical point dryer</b>
+|style="background:WhiteSmoke; color:black"|<b>Ethanol Fume dryer</b>
 |-
 !style="background:silver; color:black;" align="center" width="60"|Location
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 |style="background:WhiteSmoke; color:black"|
 *D-3
+|style="background:WhiteSmoke; color:black"|
+*C-1
 |-
 !style="background:silver; color:black;" align="center" width="60"|Purpose
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 *Drying
 *Rinsing + drying
+|style="background:WhiteSmoke; color:black"|
+*Drying sensitive samples. E.g. with cantilevers
 |style="background:WhiteSmoke; color:black"|
 *Drying sensitive samples. E.g. with cantilevers
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 *1 to 5 wafers per run. Sizes: 2”, 4" or 6"
 * Pieces (up to 10x10mm)
+|style="background:WhiteSmoke; color:black"|
+*1-25 50 mm wafers
+*1-25 100 mm wafers
+*Pieces if a suitable carrier is available
 |-
 | style="background:LightGrey; color:black"|Allowed materials
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 *InAlP, GaAs
 *SU8
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+*No restriction except for polymers
 |-
 |}