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Specific Process Knowledge/Lithography/Development/Developer TMAH UV-lithography processing: Difference between revisions

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Taran (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers, NLAB-Nlab307-labadviser-users-34891
3,528 edits
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''Flow names and process parameters:''
''Flow names and process parameters:''
*'''T2 5214E image reversal bake'''
*'''DCH PEB 110C 60s'''
Process parameters: 100s contact bake at 110°C.
Process parameters: 60s bake at 110°C.


==Combined PEB and development==
==Combined PEB and development==
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