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== Comparison of equipment/material ==
== Comparison of equipment/material ==
* prøveformat/størrelse
* forudsætninger
* mønsterdannelse
* throughput
* min/max featuresize
* min/max aspect-ratio
* post-treatment
* degree of freedom


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
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|-
|-
|-style="background:silver; color:black"
|-style="background:silver; color:black"
! '''Polymers'''
!  
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/UVLithography|UV Lithography]]
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
![[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!General description
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
|
|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
|
|Reactive sputtering
|
|
|
|
|
|-
|-
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|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Allowed materials
|
|1
*Silicon
|2
*Silicon oxide
|3
*Silicon nitride
|4
*Pure quartz (fused silica)
|5
Processed wafers have to be RCA cleaned
|6
|
|-
*Silicon
 
*Silicon oxide (with boron, phosphorous and germanium)
|-
*Silicon nitrides (with boron, phosphorous and germanium)
|-style="background:WhiteSmoke; color:black"
*Pure quartz (fused silica)
!Sample sizes
|Any
|1
|
|2
|3
|4
|5
|6
|-
 
|-
|-style="background:LightGrey; color:black"
!Prerequisites
|1
|2
|3
|4
|5
|6
|-
 
|-
|-style="background:WhiteSmoke; color:black"
!Pattern generation
|1
|2
|3
|4
|5
|6
|-
 
 
|-
|-style="background:LightGrey; color:black"
!Throughput
|1
|2
|3
|4
|5
|6
|-
|-
|}


{|border="1" cellspacing="1" cellpadding="3" style="text-align:left;"  
|-
|-style="background:WhiteSmoke; color:black"
!Min/max featuresize
|1
|2
|3
|4
|5
|6
|-
|-


|-
|-
|-style="background:silver; color:black"
|-style="background:LightGrey; color:black"
! '''Metals/Silicon/Glass'''
!Min/max aspect-ratio
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
|1
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
|2
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
|3
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
|4
|5
|6
|-
|-


|-
|-
|-style="background:WhiteSmoke; color:black"
|-style="background:WhiteSmoke; color:black"
!Generel description
!Post-treatment
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
|1
|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
|2
|Reactive sputtering
|3
|
|4
|5
|6
|-
|-


|-
|-
|-style="background:LightGrey; color:black"
|-style="background:LightGrey; color:black"
!Allowed materials
!Patterning degree of freedom
|
|1
*Silicon
|2
*Silicon oxide
|3
*Silicon nitride
|4
*Pure quartz (fused silica)
|5
Processed wafers have to be RCA cleaned
|6
|
*Silicon
*Silicon oxide (with boron, phosphorous and germanium)
*Silicon nitrides (with boron, phosphorous and germanium)
*Pure quartz (fused silica)
|Any
|
|-
|-
|}
|}


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