Specific Process Knowledge/Direct Structure Definition: Difference between revisions

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VisualWikitext

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 [[image:Define your structure directly.png|right|x200px|Define the structure directly on your sample]]
-By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps.
+By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps. Some of the techniques may require a master.
-Advantages of direct structure definition may be ..
-* Quicker process because no need for masking steps
-* In some cases the structure is defined directly by a computer, so changes in the design can be made very quickly.
-*
-Dis-advantages could be
-* Limited choice of materials
-* Limited resolution
-*
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 == Choose method of structuring/equipment ==
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 * [[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
 * [[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool/ablation]]
-* Dicing saw
+* [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
 == Materials for structuring ==
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 *Glass
 **[[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser ablation]]
-** dicing saw
+** [[Specific Process Knowledge/Back-end processing/Disco Saw|Dicing saw]]
-**[[/Sandblasting|Sandblasting (at DTU Nanotech).]]
+**[[Specific Process Knowledge/Back-end processing/Sandblasting|Sandblasting (at DTU Nanotech).]]
 == Comparison of equipment/material ==