Specific Process Knowledge/Direct Structure Definition: Difference between revisions

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! Polymers
! '''Polymers'''
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
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! '''Metals/Silicon/Glass'''
![[Specific Process Knowledge/Lithography/NanoImprintLithography|Nano Imprint Lithography]]
![[Specific Process Knowledge/Lithography/3DLithography|2-Photon Polymerization Lithography]]
![[Specific Process Knowledge/Back-end processing/Polymer Injection Molder|Polymer Injection Molder]]
![[Specific Process Knowledge/Back-end processing/Laser Micromachining Tool|Laser Micromachining Tool]]
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|-style="background:WhiteSmoke; color:black"
!Generel description
|Low Pressure Chemical Vapour Deposition (LPCVD furnace process)
|Plasma Enhanced Chemical Vapour Deposition (PECVD process)
|Reactive sputtering
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!Allowed materials
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*Silicon
*Silicon oxide
*Silicon nitride
*Pure quartz (fused silica)
Processed wafers have to be RCA cleaned
|
*Silicon
*Silicon oxide (with boron, phosphorous and germanium)
*Silicon nitrides (with boron, phosphorous and germanium)
*Pure quartz (fused silica)
|Any
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Revision as of 11:36, 6 October 2014

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Direct Structure Definiton

Define the structure directly on your sample
Define the structure directly on your sample

By direct structure definition we mean that you form the structures for you device directly in the material that the device consist of without any masking steps.

Advantages of direct structure definition may be ..

  • Quicker process because no need for masking steps
  • In some cases the structure is defined directly by a computer, so changes in the design can be made very quickly.

Dis-advantages could be

  • Limited choice of materials
  • Limited resolution

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Choose method of structuring

Materials for structuring

Choose equipment

Comparison of equipment/material

Polymers Nano Imprint Lithography 2-Photon Polymerization Lithography Polymer Injection Molder Laser Micromachining Tool
Generel description Low Pressure Chemical Vapour Deposition (LPCVD furnace process) Plasma Enhanced Chemical Vapour Deposition (PECVD process) Reactive sputtering
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Pure quartz (fused silica)

Processed wafers have to be RCA cleaned

  • Silicon
  • Silicon oxide (with boron, phosphorous and germanium)
  • Silicon nitrides (with boron, phosphorous and germanium)
  • Pure quartz (fused silica)
 Any
Metals/Silicon/Glass Nano Imprint Lithography 2-Photon Polymerization Lithography Polymer Injection Molder Laser Micromachining Tool
Generel description Low Pressure Chemical Vapour Deposition (LPCVD furnace process) Plasma Enhanced Chemical Vapour Deposition (PECVD process) Reactive sputtering
Allowed materials
  • Silicon
  • Silicon oxide
  • Silicon nitride
  • Pure quartz (fused silica)

Processed wafers have to be RCA cleaned

  • Silicon
  • Silicon oxide (with boron, phosphorous and germanium)
  • Silicon nitrides (with boron, phosphorous and germanium)
  • Pure quartz (fused silica)
 Any



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