Jump to content

Specific Process Knowledge/Etch/DryEtchProcessing: Difference between revisions

← Older editNewer edit →
VisualWikitext
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,565 edits
Jmli (talk | contribs)
DCH-Employees-701, NLAB-Employees-701, NLAB-LabmanagerAllUsers
4,565 edits
Line 12: Line 12:
|-
|-
| style="background: LightGray"| [[/Comparison| Hardware comparison]]
| style="background: LightGray"| [[/Comparison| Hardware comparison]]
| [[/Bonding| Temporary bonding]]
! style="background:#DCDCDC;"| Comparison of the different hardware setups
|-
|-
|style="background: #DCDCDC"| Comparison of the different hardware setups
!style="background: LightGray"| [[/Bonding| Temporary bonding]]
|Processing different sizes of substrates by bonding to carriers
|style="background: #DCDCDC"| Processing different sizes of substrates by bonding to carriers
|-
|-
|}
|}
Retrieved from "https://labadviser.nanolab.dtu.dk//index.php?title=Specific_Process_Knowledge/Etch/DryEtchProcessing"