Specific Process Knowledge/Thermal Process/Oxidation/Wet oxidation C1 furnace: Difference between revisions
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The boat was fully filled with dummy wafers, and there are three tested wafers per run. The three tested wafers were placed at slot number 6, 15 and 24. | The boat was fully filled with dummy wafers, and there are three tested wafers per run. The three tested wafers were placed at slot number 6, 15 and 24. | ||
'''Pressure:''' Atmosphere | '''Pressure:''' Atmosphere | ||
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'''Steamer Flow Rate:''' 10, 17.5, 25 L/min | '''Steamer Flow Rate:''' 10, 17.5, 25 L/min | ||
'''Anneal:''' Same | '''Anneal:''' Same as process temperature for 20 minutes with N2: 6 SLM | ||
'''Test Wafers:''' N-Type <100> No RCA Clean | '''Test Wafers:''' N-Type <100> No RCA Clean | ||