Specific Process Knowledge/Etch: Difference between revisions
New page: == Choose material to be etched == *Aluminium *Chromium *Titanium *Gold *[[Etching of Platin|... |
No edit summary |
||
Line 13: | Line 13: | ||
== Choose a dry etch | == Choose a dry etch equipment == | ||
*[[RIE (Reactive Ion Etch)]] | *[[RIE (Reactive Ion Etch)]] |
Revision as of 09:58, 12 October 2007
Choose material to be etched
- Aluminium
- Chromium
- Titanium
- Gold
- Platin
- Polymer
- Silicon
- Silicon Nitride
- Silicon Oxide
- Bulk Glass - Borofloat (pyrex) and fused silica (quartz)
Choose a dry etch equipment
Choose a wet etch
- Wet Silicon Nitride Etch
- Wet Silicon Oxide Etch (BHF)
- KOH Etch - Anisotropic silicon etch
- Wet Polysilicon Etch - Isotropic silicon etch
- Wet Aluminium Etch