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Specific Process Knowledge/Lithography/CSAR: Difference between revisions

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DCH-Employees-701
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DCH-Employees-701
2,257 edits
Line 351: Line 351:
|Resist
|Resist
|Fumehood D-3
|Fumehood D-3
|AR-P 6200/2 AllResist E-beam resist diluted 1:1 in anisole (Bottled opened 16-06-2014 TIGRE)
|Resist: AR-P 6200/2 diluted 1:1 in anisole (Bottled opened 16-06-2014 TIGRE)
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Line 358: Line 358:
|Spin Coat
|Spin Coat
|Spin Coater LabSpin A-5
|Spin Coater LabSpin A-5
|1 min @ 6000 rpm, 2000 1/s2, softbake 1 min @ 150 degC, thickness ~50nm (27-08-2014 TIGRE)
|Spin: 1 min @ 6000 rpm, acc: 2000 1/s2, softbake: 1 min @ 150 degC, thickness: ~50nm (27-08-2014 TIGRE)
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|E-beam exposure
|E-beam exposure
|JEOL 9500 E-2
|JEOL 9500 E-2
|0.2 nA, aperture 5, dose 180-420 muC/cm2, Shot pitch 7-27 nm, No proximity error correction (27-08-2014 TIGRE)
|Condition file: 0.2nA_ap5, doses: 180-420 muC/cm2, Shot pitch: 7-27 nm, PEC: no (27-08-2014 TIGRE)
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Line 374: Line 374:
|Develop
|Develop
|Fumehood D-3
|Fumehood D-3
|SX-AR 600-54/6 60 sec, 30 sec IPA rinse (28-08-2014 TIGRE)
|Developer: SX-AR 600-54/6, time: 60 sec, Rinse: 30 sec in IPA (28-08-2014 TIGRE)
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|Characterization
|Characterization
|Zeiss SEM Supra 60VP, D-3
|Zeiss SEM Supra 60VP, D-3
|3 kV, WD below 4mm, conducting tape close to pattern (29-08-2014 TIGRE)
|Acc voltage: 3 kV, WD: < 4mm, conducting tape close to pattern (29-08-2014 TIGRE)
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