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Specific Process Knowledge/Lithography/CSAR: Difference between revisions

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{| class="wikitable collapsible collapsed" style="border: 5px solid black;"  style="width: 90%;" align="center"  
{| class="wikitable collapsible collapsed" style="border: 5px solid black;"  style="width: 90%;" align="center"  
!colspan="6"|Wafer 4.09, 50 nm exposed pattern, shot pitch 5 nm
! Wafer 4.09, 50 nm exposed pattern, shot pitch 5 nm
|-
|-
! 230 [muC/cm2]
! 230 [muC/cm2]
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